|
 Short Course 1 |
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| TOPIC |
| • Characterization and Testing Methods for MEMS reliability. |
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| ORGANIZER AND PRESENTERS |
• Dr. Ingrid De Wolf, IMEC, Leuven, Belgium (organizer)
• Dr. Xavier Lafontan, Novamems, Toulouse, France |
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| DURATION: 4 lectures of 1:30 hr |
| 08:00-09:00 |
Registration |
| 09:00-10:30 |
Fondamentals and failure mechanisms.
Dr. Ingrid De Wolf |
| 10:30-11:00 |
Coffee break |
| 11:00-12:30 |
Test and failure analysis methods.
Dr. Ingrid De Wolf | Xavier Lafontan |
| 12:30-14:00 |
Lunch break |
| 14:00-15:30 |
Design and manufacturing for reliability.
Dr. Xavier Lafontan |
| 15:30-16:00 |
Coffee break |
| 16:00-17:30 |
Material characterization and prospects.
Dr. Ingrid De Wolf | Xavier Lafontan |
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| SUMMARY |
This short course will discuss characterization and test methods for MEMS reliability, including MEMS packages. After an introduction on reliability, the difference and similarities between reliability studies of MEMS and reliability studies of IC’s or IC packaging will be discussed. Ways to tackle reliability, through standard testing or FMEA/physics of failure driven will be explained. A short overview will be given on failure mechanisms that can occur in MEMS. The main focus of the course is on characterization and test methods to study the reliability of MEMS and MEMS packages. It will be shown that several existing techniques can be used to test MEMS (ex. SEM, FIB, electrical probing, SAM, environmental test chambers,…) but that MEMS also need dedicated test methods (dedicated chambers, optical monitoring techniques,…). Reliability testing also requires failure analysis. The course will give an overview of failure analysis techniques that can be used for this purpose. MEMS reliability is often linked to materials related reliability issues. It requires information on material properties. Techniques that can be used to gather this information will be discussed. It will be shown that several reliability issues in MEMS can be solved by a proper design, by packaging, by applying alternative actuation schemes, or by applying the correct technology for a certain application. At the end, prospects and future areas of research will be highlighted. |
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| OUTLINE |
- Fondamentals and failure mechanisms
o Introduction and Fundamentals
- Reliability
- FMEA
o Failure mechanisms of MEMS and MEMS packages
(stiction, creep, fatigue, charging, electromigration,…)
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- Test and failure analysis methods.
o Test methods for MEMS reliability
- electrical
- optical
- others…
o Test methods for MEMS package reliability
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- Design and manufacturing for reliability.
o Design/operation/ manufacturing for reliability
o Differences between technologies from a reliability view of point
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- Material characterization and prospects
o Material characterization methods for MEMS/NEMS
o Prospects and future areas of research and development
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| Biography of Presenters: |
Ingrid De Wolf received the MS degree in Physics and the PhD in Sciences, Physics, both from the "Katholieke Universiteit Leuven, Belgium". From September 1989 on she joined the Reliability group of the Interuniversity MicroElectronics Center (IMEC). She worked in the field of reliability physics of semiconductor devices, with special attention for mechanical stress aspects and failure analysis. From beginning 1999 on, she heads the group REMO (Reliability and Modelling), where research is focused on Reliability and Modelling of MEMS, MEMS-packaging and IC-interconnect and packaging. |
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Xavier Lafontan received the PhD in Microsystems and Microelectronics from the University of Montpellier II in November 2001 and prior to that, the Engineer degree in Microelectronic Engineering from the Institute of Sciences of the Engineer of Montpellier in 1998. From 2001 up to 2003, he led the Failure Analysis and Quality Assurance department of MEMSCAP Wireless Communication Business Unit. In 2003, he left MEMSCAP and founded NOVA MEMS, a start up specialized in reliability and quality assurance services for Micro and Nano Technologies. For the last three years, the company’s developed several innovative techniques and methods for the characterization of thin film materials and, the localization and environmental study of MEMS failure mechanisms. |
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